PCB Substrates for Special Applications

Innovative quantum sensor substrates for high-performance, multidimensional measurement and diagnostic systems.
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Image: PCB substrate with NV diamond sensor technology for special applications

Key Facts at a Glance

PCB Substrates for Special Applications

Structure & Functionality

The PCB substrates are based on an innovative combination of classical PCB technologies and embedded sensor elements.

Depending on the application, carrier materials – such as semiconductor wafers, microelectronic circuits, MOEMS, ceramics, glass, or composite layers – are anchored with diamond nanocrystals with NV centers through a radiation-hardened medium. These sensor elements self-align onto the relevant PCB areas (e.g., regions with waveguides, pads, structures for magnetic field or current measurement).

The sensors and sensor surfaces are optically pumpable and readable: pump light and evaluation fluorescence are guided through the transparent carrier material – contact-free, galvanically and thermally separated. This integration enables extremely precise, imaging measurement of magnetic, electrical, and structural properties on the PCB directly during operation, development, or testing.

Advantages of the Technology

Industries & Application Areas: Economic Benefits

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